Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve
We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde
Electronics Forum | Fri Jan 24 19:49:40 EST 2003 | jonfox
QSA series was a joint project, but Quad machines still use feeders made by Samsung, or Samsung makes the feeders Quad designed (whatever). QSoft has two different evolutions, Qsoft(1) went to Samsung, and Qsoft(2) stayed with Quad. I'm sure they h
Electronics Forum | Fri Jan 24 17:53:42 EST 2003 | razan3
Chipbonder is best applied with a stencil. Too bad on the dispenser purchase. Little hint, use a Kapton Stencil. You can have them laser cut and can get them as thick as you want. Another advantage is the ability to make shapes etc for cleaning
Electronics Forum | Fri Jan 24 17:07:55 EST 2003 | razan3
This question is like asking what kind of boat should you buy. Depends on what you do with it.... I would ditto the CP40. Good discrete placer and very reliable. Your PCB Design, Stencil, Reflow Oven and Paste selected are just as critical to you
Electronics Forum | Fri Jan 31 14:33:37 EST 2003 | joeherz
Dave, I do have the mechanical drawings but no electronic versions. After looking at the cost of setting up for N2 I decided against it for now, BTW. If you think about it, having an air knife on this nozzle would tend to negate the negative effec
Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave
Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are
Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper
Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s
Electronics Forum | Sat Feb 15 06:40:14 EST 2003 | Hans Koerner, Germany
It is a serius problem with that mulilayer ceramic caps! In automotive applications you have to use 2 in series for one single cap. During depanelizing you create a mechanically wave in the board, so 3.. 4 mm. Best way is not to do such a wrong desig
Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan
Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w
Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef
Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil
