Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron
Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any
Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii
Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
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