New Equipment | Test Equipment
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202, IEC-68-2-54. Complete monitoring and control of steam or water temperature. Features include: Automatic timing of the test duration, digital indicator for elapsed time and cycle tim
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
Electronics Forum | Thu Jun 16 22:07:16 EDT 2005 | davef
Chris As you imply, testing board and component solderability prior to assembly is preferred. * ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * ANSI/J-STD-003 - Solderability Tests for Printed Boa
Electronics Forum | Mon Mar 05 22:42:30 EST 2007 | davef
On your ENIG thickness requirements, search the fine SMTnet Archives for previous discussions, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=33661 On determining if your board will solder properly: ANSI/J-STD-003, Solderability Te
Electronics Forum | Tue Dec 07 17:38:50 EST 2004 | davef
ANSI/J-STD-003 - Solderability Tests for Printed Boards is widely accepted. That's it, that's the list. If you email us your email address, we'll give you someone to call. Without knowing the number of boards that you plan to run across your wave,
Electronics Forum | Mon Sep 29 17:31:39 EDT 2008 | davef
Q1.Does anyone know a way to verify the amount of OSP coating on a board? A1. There is no specification. Thickness is difficult to measure. Thickness is product related. There are at least six major suppliers. Years ago, here on SMTnet, J Medernach s
