Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2019-07-29 10:35:47.0
ACI Technologies can assist its users with process development and experimentation through the use of the conformal coating capabilities in the Demonstration Factory. Four types of coating processes are available at ACI Technologies: dip coating, manual spray coating, programmable spray coating, and manual brush application. (Manual brush application will not be discussed in this article.)
Technical Library | 2023-09-16 04:04:13.0
Online axial insertion machines are a fast and efficient way to insert components into PCBs. They are ideal for mass production applications where accuracy and repeatability are essential.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 2023-09-16 03:55:52.0
Odd form insertion machines are the perfect solution for unique applications where standard machines cannot be used. They can insert a variety of odd-shaped components, such as rivets, washers, and studs.
Technical Library | 2023-09-18 03:44:40.0
Unleash the art of PCB assembly with our SMT manual printers. Elevate your craftsmanship and achieve precision in solder paste application. Discover our reliable solutions today!
Technical Library | 2023-09-15 09:50:38.0
Discover the power of I.C.T UV Curing Oven. Achieve quick and dependable curing for your applications. Enhance efficiency and quality with our UV curing solutions.
Technical Library | 2019-05-30 11:02:07.0
In a previous Tech Tip (see Battery Selection for Electronic Systems), considerations were discussed for selecting an appropriate battery for an application. After selection, testing should be performed to confirm that the battery can provide the power required for the specific application. Some battery definitions should be understood when discussing power load qualification testing of batteries.
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
