Electronics Forum: bga lf hasl (Page 1 of 15)

Solderability Issues

Electronics Forum | Mon Aug 02 08:54:15 EDT 2010 | vetteboy86

I believe it is LF HASL. I will need to double check.

HASL surface finish

Electronics Forum | Fri Jun 12 21:36:04 EDT 2020 | SMTA-Josh

Has anyone had an issue with changing from a HASL surface finish to a LF HASL finish if it is still being used in a leaded process? Also we are having issues with the planarity on the fiducials with the HASL finish. Are there any suggestions or ch

Lead Free BGA's on non-RoHS Assembly

Electronics Forum | Mon Jan 29 10:41:10 EST 2007 | davef

Many high rel assemblers reball their LF BGA with SnPb balls. In other less demanding environments, SnPb paste with LF BGA produces acceptable reliability.

Solderability Issues

Electronics Forum | Tue Aug 03 17:13:41 EDT 2010 | bradlanger

Craig, If it is LF Hasl it sounds like it applied too thin exposing the intermetallic layer wich is not solderable. We call out a minimum thickness of 80 microinches and have good results. We have had shops in the past that did not control the Hasl

Solder wick on Ag/Pd termination

Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew

Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds

SN100C Selective Solder Voiding

Electronics Forum | Mon Nov 10 12:29:59 EST 2008 | joeherz

Dave, You've got me worried - All of the boards we've tested to this point are LF HASL. Why do you say "can't be ENIG"? Am I missing something? We have not sectioned soldered boards as yet but plan to shortly. Thanks.

Solderability Issues

Electronics Forum | Fri Aug 13 17:45:43 EDT 2010 | bradlanger

Boards with the LF hasl finish applied too thin will genrally pass the IPC test. That is some pretty agressive flux they call out. The boards usually wave solder just fine as well. Reflow is where the you see the problem.

Tin/Lead HASL Plating in a Lead Free Process

Electronics Forum | Tue Jan 31 15:25:14 EST 2012 | joeherz

Hege, Yes. Good info. We have other products that run lead free process with known non-RoHS compliant components. All of these are using LF process compliant fabs however so this is the first time we have been in this position. Thanks.

Tin/Lead HASL Plating in a Lead Free Process

Electronics Forum | Mon Feb 06 19:11:25 EST 2012 | broncomania

Yes. You need to educate your customer... On a side note, hopefully these boards hasn't gone through wave over your LF solder pot.. This will contaminate your solder pot and won't be cheap to fix it.

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Fri Dec 16 20:22:44 EST 2005 | Homer J

There are some RoHS BGA:s that are within the "so called" solder joint strength & reliability, that can be solder in a non LF-environment! Certaininly LF-free or RoHS BGA will sometimes work the other way around. (I know about the ball melting point)


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