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NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS FROM MIRTEC TO BE DISPLAYED DURING NEPCON SOUTH CHINA 2013

Industry News | 2013-07-29 13:51:15.0

MIRTEC Co., Ltd. “The Global Leader in Inspection Technology,” today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth # A-1E45 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.

MIRTEC Corp

MIRTEC TO PREMIER NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS DURING NEPCON CHINA 2013

Industry News | 2013-04-17 11:18:13.0

MIRTEC Co., Ltd. today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth #1G68 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

MIRTEC Corp

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Northrop Grumman Enters Military Printed Circuit Board Market

Industry News | 2003-04-15 08:39:15.0

Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)

SMTnet

Rogers Corporation Reports 50% Increase in Earnings

Industry News | 2003-04-25 08:11:22.0

Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

Yamaha YS24 SMT mahcine

Yamaha YS24 SMT mahcine

Used SMT Equipment | Semiconductor & Solar

Yamaha YS24 SMT mahcine Model YS24: (Note: high-speed machine) Object substrate: L50 x W50mm to L700 x W460mm Mount capacity: 72,000CPH (0.05s /CHIP: our best condition) Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X YAMAHA multi-functional chip mounter

Yamaha YV100X YAMAHA multi-functional chip mounter

Used SMT Equipment | Semiconductor & Solar

Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0  substratetransfer direction

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X

Used SMT Equipment | Semiconductor & Solar

V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip)                QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X

Used SMT Equipment | Semiconductor & Solar

V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip)                QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD


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