Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
15W UV Laser Economic PCB Laser Depaneling System PCB Laser Depaneling System Specification: Laser solid-state UV laser Laser Wavelength 355nm Laser Source UV 15W@30KHz Positioning Precision ±2μm
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
Laser PCB Cutting Machine Function: The equipment is mainly used in the cutting 5G materials such as CCM / COB / LCP / MPI / COF / cop / pi / CPI in consumer electronics. The equipment integrates high-speed and high-precision optical processing syst
New Equipment | Test Equipment
Metal dome (also named snap dome, tacticle domes) is the most improtant part of the switches. The metal domes are mainly use in the membrane switches, printed circuit boards, flexible circuit boards. The raw material is the thickness from 0.05mm to 0
New Equipment | Assembly Services
Flexible PCB assembly Flexible PCB assembly or FPC assembly is a process that is mounting electronic components on flexible plastic substrates such as polyimide, PEEK, or a transparent conductive polyester film. With the development of electronic p
The New Plug & Print 3D Printer with Dedicated Software and Filament. 3D printer valued by thousands of users. The reliable, efficient and extremely precise Zortrax M200 has already won the hearts of thousands of users. The device’s affordable pric
Casing, Tubing for Wells, Oil Pipe, Oil Pipeline Usage:Tube for conveying gas, water, and oil in both and natural gas industries etc. Casing:Casing is a large-diameter pipe that serves as the structural retainer for the walls of oil and gas wells,
Industry News | 2002-03-29 07:49:10.0
A Corporate Workforce Reduction of 25%
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