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ALTRON Partners with MIRTEC to Provide Total Quality 3D AOI Solution

Industry News | 2016-11-07 19:40:51.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that ALTRON, Inc., a veteran-owned, service-orientated, contract manufacturing company specializing in high-quality circuit board and mechanical box build assemblies, has selected MIRTEC as its 3D AOI partner with the purchase of six MV-7 OMNI 3D AOI machines.

MIRTEC Corp

CALTRONICS Purchases MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machine at SMTAI 2016

Industry News | 2016-11-01 19:52:12.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.

MIRTEC Corp

Electronics Manufacturing Mini Camp

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

PCB Reflow Oven Machine I.C.T Lyra Series

PCB Reflow Oven Machine I.C.T Lyra Series

New Equipment | Reflow

PCB Reflow Oven Machine I.C.T Lyra Series I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future I.C.T brings 26 years of experience in the SMT industry. On-site installation and training Availa

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA International Call for Papers

Industry News | 2010-02-17 18:45:59.0

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

SMTAI Call for Papers

Industry News | 2009-03-12 18:25:36.0

The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

Contract Manufacturing Symposium at SMTA International

Industry News | 2011-08-08 16:18:31.0

The SMTA announced that the Contract Manufacturing Symposium will be held on October 18, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The symposium, aimed at OEMs, and EMS program managers and executives, looks at risk mitigation strategies from Asia to Eastern Europe, and selected SMT processing solutions that could benefit those companies grappling with RoHS and other environmental or leading-edge (high BGA pin count) technical issues.

Surface Mount Technology Association (SMTA)


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