Electronics Forum | Tue May 28 12:56:22 EDT 2019 | dekhead
It is a communications failure between the CPU and the Cognex card. Does comms initiate between the 2 cards (flashing green on both)? or does it immediately come up red LED on Cognex? Have you reseated the CPU board as well as the Cognex? Is this a s
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Fri Jan 12 09:22:51 EST 2018 | dskling
Hello We have a Vitronics XPM820 that has us stumped. We have replaced both power supplies (G1 and G2) and we still cannot clear this alarm. The A1 board has all 4 leds light for proper voltages. We have verified that we are getting the correct vo
Electronics Forum | Mon Oct 03 10:41:57 EDT 2011 | patrickbruneel
Some of us here attended the 5th CALCE international symposium on tin whiskers http://www.calce.umd.edu/symposiums/ISTW2011.htm where one of my former professors, Dr. Henning Leidecker, talked about the tin whiskers he and the others at NASA Godda
Electronics Forum | Wed Aug 24 09:20:25 EDT 2016 | dekhead
Suspect comms link error from Y3 to Y1 crate. COM 2 off of CPU, depending on board. If CPU board has RS485 port it is direct to back panel of PC; if older board it only has RS232 and thus requires 232/485 converter board (internal to PC). then direct
Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef
The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound
Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi
| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Mon Dec 04 18:29:47 EST 2006 | SWAG
Some production problems we've faced: 1) Delamination; 2) Reflow fixture distortion; 3) Obsolete parts; 4) Failure of blower motor bearings in older reflow ovens; 5) Poor toe fillets with miniSOTs on thicker PCB's; 6) Lack of updated component data s
