Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2011-08-18 21:24:08.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Events Calendar | Tue Mar 07 00:00:00 EST 2017 - Thu Mar 09 00:00:00 EST 2017 | Fountain Hills, Arizona USA
13th International Conference and Exhibition on Device Packaging
International Microelectronics Assembly and Packaging Society (IMAPS)
Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2012-04-12 05:45:03.0
Announcement is a step further in confirming StarChip’s strategic commitment to the Smart Card business by extending its product portfolio into payment and ID markets.
Industry News | 2011-04-07 11:31:09.0
Practical Components announces that its dummy components have been invited to be part of the "Future Proof Assembly Line" at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Industry News | 2012-01-10 20:15:40.0
Four new pavilions - Touch Screen Manufacturing, Advanced Electronics Packaging, Electronics Manufacturing Automation and ESD - will be debuted at the 22nd edition of NEPCON China, which will be held at Shanghai World Expo Exhibition & Convention Center from April 25-27, 2012. One of the most influential electronics manufacturing and SMT trade events in Asia, NEPCON China is the trusted barometer of the local electronics manufacturing industry. The new pavilions will highlight development trends in China’s electronics manufacturing equipment sector. They also will facilitate debates on pressing issues surrounding the production of electronics.
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2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
