Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth
Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
Electronics Forum | Wed Jun 21 18:51:34 EDT 2000 | John
What is the most likely causes of shorts in the corners of BGA devices?. Is there a method of removing single shorts without removing the device?. John.
Electronics Forum | Fri Oct 27 23:08:58 EDT 2006 | KEN
slow your heating ramp down. You are "tater-chipping" the BGA.
Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Fri Oct 27 08:19:53 EDT 2006 | davef
Josh: Search the fine SMTnet Archives for background discussions. For further discussion on the "being hosed by the physics": http://www.cooksonsemi.com/tech_art/pdfs/Controlling%20Warpage.pdf
Electronics Forum | Fri Oct 27 09:05:28 EDT 2006 | jdumont
Thanks a lot for the suggestions. I will try baking and see what develops. For the record the parts are stored in nitrogen atmos. under 5% RH. Doesnt mean they werent overexposed when they got here however... JD
Electronics Forum | Fri Jun 23 08:52:16 EDT 2000 | Dave F
John: Seek your answers in the archives. As I recall someone said: � Biggest cause of BGA shorting was out-gassing in-package moisture. � Removing shorts w/o removing the device: - Preheat the board - Lower the nozzle and heat the device - Lift the
Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis
A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil
