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Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

High Volume Reflow Oven - 1936/2043 Mark5

High Volume Reflow Oven - 1936/2043 Mark5

New Equipment | Reflow

The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &

Heller Industries Inc.

SMT Reflow Oven - 1826 Mark 5

SMT Reflow Oven - 1826 Mark 5

New Equipment | Reflow

The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!

Heller Industries Inc.

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

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This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Heller Industries to Exhibit at APEX 2013 -Booth 1109

Industry News | 2013-01-04 16:00:38.0

04 Jan 2013 Heller Industries will showcase the Mark5 Series - SMT Reflow Soldering Ovens February 19-21 in San Diego, CA USA at the IPC APEX EXPO.

Heller Industries Inc.

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

Soldering Company of the Year 2020 - Heller Industries

Industry News | 2020-11-03 18:16:39.0

2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)

Heller Industries Inc.

Heller Industries Mark 5 Wins 2015 SMT China Vision Award

Industry News | 2015-05-18 10:27:49.0

Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.

Heller Industries Inc.


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