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Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Technical Library | 2021-11-03 16:49:59.0

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.

NovaCentrix

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

DH-800 Robot Automatic Dispenser

New Equipment | Soldering Robots

Model: DH-800 Robot Automatic Dispenser product model: DH-800D Dispensing range: 300/300/90 maximum load Y/Z:  10KG/6KG Speed X& Y/Z(mm/sec)   500/500/300 external dimensions : 465*495*697mm Body weight(KG): 42 capacity of decomposition :0.01m

Dongguan Kingsun Technology Co.,Ltd.

Flame Retardant Tapes

Flame Retardant Tapes

New Equipment | Components

The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas

Polyonics, Inc.

FPC UV Laser Cutting Machine

New Equipment | Depaneling

 FPC ultraviolet laser cutting machine, FPC laser cutting machine characterized by: 1, with control software with independent intellectual property rights, user-friendly interface, complete functions, simple operation; 2, can process any graphic

YUSH Electronic Technology Co.,Ltd

Rehm Thermal Systems opens new Applications Center in Roswell, Ga.

Industry News | 2010-02-22 11:53:39.0

Rehm Thermal Systems has moved into a new Applications Center which will serve their North America marketplace. Located in the Atlanta suburb of Roswell, the new facility is designed to provide Rehm customers everything needed to characterize their convection and condensation reflow processes.

Rehm Thermal Systems Korea Limited

Rehm to showcase convection & condensation soldering expertise at Apex

Industry News | 2011-03-17 16:52:47.0

Rehm Thermal Systems is preparing to showcase its advanced thermal technologies at this year’s Apex exhibition, being held in Las Vegas from 12th – 14th April. As the only single source for convection and condensation soldering systems, Rehm will be demonstrating its unique capabilities from Booth 635.

Rehm Thermal Systems Korea Limited

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

PCB cosmetic reject after reflow

Electronics Forum | Tue Aug 09 10:02:07 EDT 2005 | davef

Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down) should be greater than 330*C for lead-free. Search the fine SMTnet Archives for more on Td.


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