Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
New Equipment | Solder Materials
Proposal Pro Contra VOC (100% alcohol) 385-SEL 327-SEL No preheating needed Reliable even if not activated N
Industry News | 2018-03-24 09:45:36.0
Dendrite failure on printed circuit board assemblies is quite common but often not investigated fully to pin point the root cause. This is due to the intermittent nature of the failure or just replacing components seems to solve the problem Book at https://www.bobwillis.co.uk/event/dendrite-failure-causes-cures/
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
