Industry News | 2003-06-09 09:16:38.0
The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.
Industry News | 2018-08-21 20:05:28.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Industry News | 2022-02-16 02:48:45.0
Free of charge, EWPTE offers unique educational and networking opportunities
Industry News | 2024-01-29 11:43:33.0
IPC announces the launch of its new course titled "Foreign Object Debris (FOD) for Electronics Manufacturing," exclusively available for IPC members at no cost. Foreign Object Debris is a critical concern in electronics manufacturing that can compromise the functionality and reliability of manufactured products. The implications of FOD extend beyond the manufacturing floor, affecting product reliability, safety, and the manufacturer's bottom line.
Industry News | 2012-06-15 07:25:23.0
“Electronics in the Fast Lane: How High Speed Technologies are Changing the Game,” will be the theme of the IPC Executive Summit, August 21–22, 2012, in Schaumburg, Ill.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry Directory | Consultant / Service Provider
PCB related CAD/CAM/CAT/AOI/Measurement Tools developing.
