Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
New Equipment | Rework & Repair Equipment
The Model RW-SV2000A BGA Rework Station is a top of the line BGA Rework Station desinged to rework large circuit boards and large components. It is Nitrogen Capable for High Yield Lead Free BGA Rework, has a movable top and bottom gas heate
The biggest, baddest, most affordable Nitrogen Capable BGA Rework Station demonstrated by Dennis O'Donnell the BGA Expert! Safe, precision rework for SMD, BGA, and LED chips on boards as large as 36" or more!. The versatile E6250U rework station co
New Equipment | Rework & Repair Equipment
The Shuttle Star Model SV560 and SV560A are now available with a side view camera so that you can observe when the solder reflows . Rework any board and any chip with this High Definition, Split-Vision Optical System that will remove and place BGAs,
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
New Equipment | Rework & Repair Equipment
The Shuttle Star Model SV560 and SV560A are now available with a side view camera so that you can observe when the solder reflows . Rework any board and any chip with this High Definition, Split-Vision Optical System that will remove and place BGAs,
