Electronics Forum | Wed Jun 22 02:30:33 EDT 2011 | boardhouse
if its a RoHs Assembly they should be using an FR4 material designed with higher TD to handle higher Assembly temps. 370HR,IT158, IT180, 4000-29 just to name a few that would be suitable. Standard FR4 material is not designed to handle the higher as
Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse
Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15
Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter
Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these
Electronics Forum | Thu Jun 25 22:25:24 EDT 2009 | boardhouse
In the life of this product that you have been doing this process, has the material alway's been IT180 material? One problem with Lead free material is that it is more fragile that standard FR4 Epoxy laminate. And is known to have chipping or fractu
