Electronics Forum | Wed Jan 09 06:43:07 EST 2002 | joe
I find the most reliable method is soldering the thermcouple to the joint or between the pin and pad. One thing to take care of is not to use to much solder, which would increase the thermal mass.
Electronics Forum | Tue Apr 08 18:08:27 EDT 2003 | joe
Hello all, I've been out of the P&P process loop for a while and remember when Philips was trying to take over the small FP, flexible world. Where have they gone? Are they called Philips anymore? A web URL would be most helpful. Thanks.
Electronics Forum | Thu Feb 12 16:25:18 EST 2004 | joe
For those of you that do not know it, our little Republic here is based on Capitalism. Corporations have a right to make a profit. Moreover, a corporation has a responsibility to internal and external stakeholders. Employees are internal and sharehol
Electronics Forum | Mon Oct 25 21:08:39 EDT 2004 | joe
We will be outsourcing all of our PCBAs and would > like to know if other companies perform DVT > testing, ESD, Emissions on all of your boards or > only on main boards? Our shipping deadline is > near and I would like to determine the risk in >
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Fri Aug 04 07:21:28 EDT 2006 | joe
Does anyone have any ideas on how to keep my soldering tips from turning black when using lead free solder. I am going through a lot of tips. Thanks
Electronics Forum | Wed Mar 27 16:32:22 EDT 2024 | SMTA-64387182
Thanks all, That is very helpful. Joe
Electronics Forum | Fri Aug 30 11:20:17 EDT 2013 | jth
Hi, contact me at joe@zntechnologies.com. ZN Technologies offers warpage measurement at room temp and during reflow using the superior projection moire technique. Best regards, Joe
Electronics Forum | Tue Mar 12 16:01:32 EDT 2024 | SMTA-64387182
What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe
