New SMT Equipment: microvias (Page 1 of 2)

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

Quick Turn PCB for Pad with Shengyi S1141 and 1+N+1 Blind Microvias

New Equipment | Prototyping

Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture

Heros Electronics (Shenzhen) Co., Ltd.

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

PCB Laser Services

PCB Laser Services

New Equipment | Depaneling

MLT provides rigid and flexible circuit laser services including laser routing (excising), cavity skiving, coverlay/coverfilm routing, microvia drilling, ZIF Contours, Kapton window skives, depaneling, and marking. With 20 years experience, MLT has

Micron Laser Technology

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

8 layers 1-stage HDI board huanyupcb.com

8 layers 1-stage HDI board huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

PE-100 Plasma Etch Benchtop Plasma System

PE-100 Plasma Etch Benchtop Plasma System

New Equipment | Prototyping

Compact Plasma Etcher The PE-100 is a complete system with vacuum pump designed to be reliable yet inexpensive enough to allow startup companies, medical labs and R&D facilities the opportunity to experience Plasma Etch technology. The all aluminum

Plasma Etch, Inc.

CA Design Printed Circuit Board Service Bureau

CA Design Printed Circuit Board Service Bureau

New Equipment |  

Printed Circuit Board Design Service Bureau for high quality, low cost source for Printed Circuit Design, Training, Fabrication, and Project Management. While every job is unique, CA Design employs a battle-proven process for ensuring that your desi

CA Design

CA Design Printed Circuit Board Service Bureau

New Equipment |  

Printed Circuit Board Design Service Bureau for high quality, low cost source for Printed Circuit Design, Training, Fabrication, and Project Management. While every job is unique, CA Design employs a battle-proven process for ensuring that your desi

CA Design


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