Electronics Forum | Wed Aug 18 02:17:37 EDT 2010 | tennythomas
I heard that one can create the stacked/staggered microvias in the layers 1-2 & 2-3 and skip microvia in the layer 1-3 of 6 layer stack up, when the prepreg is between layers 1 & 2 and the other prepreg is between the layers 2 & 3. I want to know w
Electronics Forum | Thu Oct 11 14:32:30 EDT 2012 | blnorman
Are the microvias in the BGA ball pads?
Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob
Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
Electronics Forum | Mon Jan 17 19:29:54 EST 2000 | Michael Allen
I'm searching for technical papers on the topic of via-in-pad (through-vias, not micro-vias) -- hopefully with reliability test results. There's been zero response to this question in the past, but I thought I'd ask again. References would be great
Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef
Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den
Electronics Forum | Fri May 10 17:42:55 EDT 2002 | davef
I don't know �solder ballooning� from a shoebox. So, rather than let this degrade solely into a rant about the evils of via in pad, please get me up-to-speed in jargon.
Electronics Forum | Thu Jun 09 21:45:23 EDT 2005 | davef
We don't know, but we'd contact Enthone-OMI [ http://www.enthone-omi.com ] for suggestions. Enthone makes materials used by fabricators of HDI, microvia boards.
Electronics Forum | Fri Jan 12 14:29:51 EST 2007 | jax
OSB ??? OSP !!! 1. The longer the soak, the fewer the Voids. 2. The Higher the soak, the fewer the Voids. Options 1 and 2 have downsides. You could call your paste supplier and see if they have a low-void solder paste... most likely formulated fo
Electronics Forum | Mon Oct 15 09:55:50 EDT 2012 | anvil1021
These microvias were plated shut? Could there have been some out gassing of these plated shut areas during reflow? I agree with your void % assesment unfortunately my Superiors do not... Thank you for the input.....anvil
