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Automatic solder paste printer machine for 1200mm PCB

Automatic solder paste printer machine for 1200mm PCB

New Equipment | Printing

Automatic solder paste printer machine for 1200mm PCB Description: LK-F1200 Ideal for LED production which for Accuracy it has built-in ±10 micron alignment,and ±25 micron wet print repeatability (≧2.0Cpk@6sigma) with 20 seconds total throughpu

Langke Automation Equipment(smdmachine.com)

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH

Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

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