Electronics Forum | Tue May 11 14:17:55 EDT 2010 | isd_jwendell
Getting the paste from the jar and into the cartridge without entrapping air can be difficult. Can you not just transfer the 500g jar into smaller working jars? This way you can keep the bulk of your paste refrigerated until needed. Air is not your f
Electronics Forum | Tue May 11 09:44:48 EDT 2010 | dyoungquist
Lower humidity: Pros: Helps with mositure sentative devices. Cons: 1)Paste exposed to the dry air during your porcess will dry out quicker. 2) Drier air promotes more ESD issues, i.e. more electrostatic generation.
Electronics Forum | Thu May 13 03:20:36 EDT 2010 | aungthura
it is true.My supplier only sell the sodler paste in Jar,1 jar must have 500g( minimum), although we wanted 250g par jar.
Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Thu May 13 01:41:31 EDT 2010 | nrw
Thank you everyone, I realise the problems now and the whole exercise might not be worth the money saved, versus just throwing out the leftover paste. I am based in Australia, so the number of players in this market is small and they know it. The pr
Electronics Forum | Tue May 11 08:21:16 EDT 2010 | nrw
Hello, I am in the process of setting up processes for a low volume SMT line for internal prototype production, where a 500g jar of solder paste would last weeks. Our distributors only seem to want to supply 500g jars (anything else is significantl
Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef
First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman
I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could
Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms
Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo
