Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon
| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua
Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean
| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall
Electronics Forum | Fri Jan 08 10:11:15 EST 1999 | Tim
This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality
Electronics Forum | Mon May 26 19:25:47 EDT 2003 | bayanbaru
How many times can a populated board been reworked? What can go wrong (reliability) if the populated board is reworked more than 4 times?
Electronics Forum | Wed Feb 03 15:18:25 EST 1999 | Michael Allen
I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the part; th
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik
| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove
Electronics Forum | Tue May 27 19:21:50 EDT 2003 | bayanbaru
Can I then say that in general boards are not encourage to rework more than 3 times since the boards will be subjected to Top and Bottom reflow? What is 55110?
Electronics Forum | Tue Nov 29 22:16:43 EST 2005 | ams_gen
Hello, Could any body direct me to guidelines describing the best practices for rework of perimeter array components (such at SOIC's and QFP's) or may be share your opinion of the best approach to do this? Thanx, AMS
Electronics Forum | Wed Nov 30 08:00:59 EST 2005 | davef
Look here: http://www.circuittechctr.com/guides/guides.shtml Also consider IPC-7711/7721: Rework and Repair Guide
