Electronics Forum | Tue Jun 10 12:11:03 EDT 2014 | jorge_quijano
this is a Class II product. If I increase the openings... will I have random solder balls?
Electronics Forum | Tue Jun 10 12:21:10 EDT 2014 | rway
Probably not considering you have ample volume left on your land area for more solder.
Electronics Forum | Thu Jul 20 12:59:52 EDT 2000 | Mike McMonagle
Bob, I attended your PIHR workshop at Nepcon a few years back. At the risk of making a shameless plug, I must say that the presentation and the materials used were some of the best I have seen in my many (20+) years in the industry. The video that is
Electronics Forum | Thu Aug 31 00:07:24 EDT 2000 | Ramon I Garcia C
I Kyung: I'm not sure if we are working with PIHR but we insert some pines in a PCB with a pin inserter machine, after that we run this pcb in a screen printer and put over its solder paste, and then run in a chip shooter and then IC placer and f
Electronics Forum | Sat May 27 09:45:52 EDT 2000 | Bob Willis
Many thanks for the name check from John Thorup PIHR can be done very simply and it can provide positive fillets on both sides of the board. I have just finished a line with SDSRS, Simultanouse Double Sided Reflow Soldering thats sodering both sides
Electronics Forum | Thu Jul 20 14:46:00 EDT 2000 | Jeanette
All the sources of information that I have read so far mentions PTH boards, has this process been tried with single sided PCB's? If it has what were the results.
Electronics Forum | Thu Jul 20 15:01:25 EDT 2000 | Bob Willis
Yes I have done this at a company. The components were automatically inserted as well. The process was screen print palce SMT reflow dispence paste Flip board insert through hole Reflow I wish we could show photos on this page and I would show you
Electronics Forum | Thu Jul 20 14:16:39 EDT 2000 | Jeanette
Is the temperature the only drawback when reflowing components other than connectors? for example caps, transformers. Is there a problem with the soldering quality if the body of the component covers the solder paste?
Electronics Forum | Thu Jul 20 14:20:17 EDT 2000 | Bob Willis
In real terms the temperature compatibility is the real issue. Yes a component can and in most case will cover the paste. The component standoffs must prevent the body contacting the paste to prevent solderballing. Bob Just back from dinner, my mum
Electronics Forum | Thu Jul 20 13:49:20 EDT 2000 | Jeanette
When dispensing paste would you reccomend dispensing the paste first then inserting the component or inserting the component, clinching the leads and then dispensing the paste. I have heard that the latter may cause dry joints. Would you use the sa
