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SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Industry News | 2018-05-21 20:39:06.0
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2017-11-13 13:38:37.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Ventec International Group, a global electronics material manufacturing company headquartered in Suzhou, China.
Industry News | 2010-04-23 22:01:16.0
BANNOCKBURN, Ill. IPC - Association Connecting Electronics Industries® has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more easily determine the capability and compatibility of flexible base dielectric materials in manufacturing flexible printed circuitry and flexible flat cables.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2020-11-13 17:10:59.0
IMI, Inc. has successfully completed an intensive audit to IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements and has earned a Qualified Manufacturer's Listing (QML) under IPC's Validation Services program.
