Electronics Forum | Thu Jan 18 07:30:13 EST 2007 | realchunks
It could be the blowers in cooling section of the oven. Try turning them off. It could be the belt is not level.
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Thu Jan 18 08:37:10 EST 2007 | CL,
"solder tends to pool on the short side of the substrate" Does the short side of the substrate have any significant difference in thermal mass? if so, try slowing the belt (within reason) or increasing temps (within reason) to better equalize therma
Electronics Forum | Thu Aug 24 14:42:30 EDT 2006 | any
y we had solder ball after reflow owen?
Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Mon Feb 02 12:36:41 EST 2004 | paul_bmc
90% of the assemblies our company produces are class 3 and we have no problem at all inspecting or getting class 3 quality through reflow. Rarely do we have touch up because of insufficient or poorly reflowed solder joints. What are the problems you
Electronics Forum | Wed Jan 28 14:35:12 EST 2004 | swagner
Has anyone in the industry had even a fair amount of success inspecting reflowed solder joints to IPC class 3 standards? I am not interested in hearing from system reps or people who work for an AOI manufacturer. Thanks,
Electronics Forum | Mon Feb 02 17:52:11 EST 2004 | swagner
We are not having a problem, we have a customer that would like us to use post reflow AOI to inspect the solder joints to class three. I would like to see if anyone is having sucess doing this.
Electronics Forum | Tue May 25 07:03:34 EDT 1999 | Milan Z.
After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) Where is the problem? Thanks in advance!
Electronics Forum | Sun May 23 10:14:14 EDT 1999 | M Cox
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
