Full Site - : rohm storage recommendation (Page 1 of 30)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Spectrum II - Solder Paste Dots & Lines

Spectrum II - Solder Paste Dots & Lines

Videos

With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su

ASYMTEK Products | Nordson Electronics Solutions

0.5m 0.8m 1.0m 1.2m 1.5m smt pcb inspection link transfer machine conveyor

0.5m 0.8m 1.0m 1.2m 1.5m smt pcb inspection link transfer machine conveyor

New Equipment | Board Handling - Conveyors

0.5m 0.8m 1.0m 1.2m 1.5m smt pcb inspection link transfer machine conveyor Product introduction: 1.Steel frame, static painted surface; 2.Balance weight design improve the stability; 3.Optional pass/inspection working mode; 4.Smooth and pa

Shenzhen Honreal Technology Co.,Ltd

Drying and storage recommendation for printed circuit boards

Technical Library | 2024-01-08 18:44:00.0

Printed circuit boards, especially multilayer, flexible and rigid-flexible printed circuit boards, are extremely hygroscopic, i.e. they absorb and bind the moisture in the air. A dried polyimide film, for example, will have reached its moisture saturation level again after just a few hours.

ILFA GmbH

Yankee Soldering Technology

Industry Directory | Manufacturer's Representative

Representing equipment, material and tooling for the assembly of printed circuit boards in New England since 1997. We represent everything needed for PCB manufacturing, like soldering systems, inspection equipment and storage.

Dow Electronic Materials

Industry Directory | Manufacturer

DEM develops and markets highly sophisticated materials used in the electronic materials segment of the global electronics value chain.

Parts and Assembly Storage Life: How to Determine and Manage

Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,

Parts and Assembly Storage Life: How to Determine and Manage

CALCE Center for Advanced Life Cycle Engineering

Storage Battery Systems SBS-EX

Storage Battery Systems SBS-EX

Used SMT Equipment | In-Circuit Testers

Storage Battery Systems SBS-EX Battery Diagnostic Tester The SBS-EX is a cost-effective version of our SBS-ULTRA . It meets all IEEE and NERC battery testing standards and accurately measures the internal resistance (mOhm), conductance (Seimens

Test Equipment Connection

Storage Battery Systems SBS-EX

Storage Battery Systems SBS-EX

Used SMT Equipment | In-Circuit Testers

Storage Battery Systems SBS-EX Battery Diagnostic TesterThe SBS-EX is a cost-effective version of our SBS-ULTRA . It meets all IEEE and NERC battery testing standards and accurately measures the internal resistance (mOhm), conductance (Seimens), volt

Test Equipment Connection

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory


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