Electronics Forum | Mon Aug 18 22:55:05 EDT 2008 | kpm135
Nozzles are really machine specific. Your best bet, if you're looking for the correct nozzle for a part, would probably be to send a strip of parts and the data sheet to the manufacture of the machine and ask them for their recommendation. Most machi
Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob
Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic
Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft
Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre
Electronics Forum | Mon Apr 09 21:20:59 EDT 2012 | action_101
Interesting thought. Our paste is 89.2% according to the data sheet I have, but it still might be worth trying the 84-86% syringe blend. Thanks for the suggestion.
Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac
Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a
Electronics Forum | Fri Aug 16 09:35:54 EDT 2013 | leemeyer
I am doing some research on Pick and Place machines and have found the Samsung brochure a bit confusing. Specifically I am looking at the SM421, some of the information I am finding states that this machine is spec'd to place 0201 and up. On the same
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Mon Aug 04 10:15:55 EDT 2008 | realchunks
Silver saver paper will work as well. Most board houses slip a sheet between your boards when they send them to you. Keep this paper with the boards and keep them sealed if possible.
