Electronics Forum | Thu Nov 18 03:54:49 EST 1999 | jacky
Hello,everyone, I want to know how I can test the reliability of the solder point.And now we just push or pull the components to test the reliability of solder point,but I don't know if there is any measure of the power applied to the component
Electronics Forum | Sat Dec 03 02:10:59 EST 2005 | Homer J
1. What are we talking about: pcb:s or pcba:s? 2. What exactly do you want to attain with this board test? 3. Are you a pcb manufactor or a pcba manufactor? 4. You did not mention what type of boards you want to test? 5. Mechanical, operating enviro
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Tue Aug 23 13:03:14 EDT 2005 | davef
What's the point of such a test? * If you are operating a board in an environment that keeps the board at a temperature that is close to causing delamination, why not design a board that can tolerate such an operating environment, rather than contin
Electronics Forum | Sun Jul 29 21:33:30 EDT 2001 | CAL
Your Ionograph and Zero-ion Values are set by you. There is no raw pass of fail criteria only the limits you set up. Ionograph is great for bare board resistivity (salt) test just as a pass fail for incoming inspection but this is all per your facto
Electronics Forum | Thu Jan 07 03:21:13 EST 1999 | Dorothy Ho
I'm looking for some SMT test sockets. Could you tell me who can do a similar job as Ironwood Electronics, Inc.? Thanks.
Electronics Forum | Fri Jan 03 12:12:22 EST 2003 | richard
Good day and thanks for your comments Mike, What did I understood from your notes� 1) ROSE test (�extracting solution�) is probably good enough (with good equipment) to penetrate the space under my micro BGA. 2) I should test 2 parallel batches of
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Fri Mar 22 10:56:41 EST 2002 | jax
Why are you unable to place this part with your Machine. Part to big? No pick up point( nozzle landing area )? No Feeder? Vision recognition? If we know why you can't place it, we might have a fix.
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