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Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Convection Reflow Oven Mk7

Convection Reflow Oven Mk7

New Equipment | Reflow

Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti

Heller Industries Inc.

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

HELLER INDUSTRIES Presents: Formic Acid Sintering

HELLER INDUSTRIES Presents: Formic Acid Sintering

Videos

Nano-copper sintering in formic acid vapor.

Heller Industries Inc.

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

HELLER'S High UPH Vacuum Oven Wins the "17th Step-by-Step Excellence Awards"

Industry News | 2023-10-18 17:43:18.0

HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp


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