► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpage
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Industry News | 2016-09-28 10:10:43.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2016 Global Technology Award in the category of Inspection – SPI for its MS-11e 3D SPI Machine. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.
Industry News | 2013-09-13 17:01:33.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2018-03-29 07:13:22.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that it has entered into a Corporate Agreement with Vectralis Engineering and USM Reps for Sales and Support of their Award-Winning SPI and AOI products and services for the country of Mexico.
Industry News | 2013-10-08 15:37:23.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2013-04-17 11:18:13.0
MIRTEC Co., Ltd. today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth #1G68 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2013-07-29 13:51:15.0
MIRTEC Co., Ltd. “The Global Leader in Inspection Technology,” today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth # A-1E45 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.
