Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F
Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles
Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo
Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so
Electronics Forum | Wed Apr 19 18:02:34 EDT 2000 | Mike Flori
If you can divide your boards into different categories it allows you to determine a different starting profile for each category, based on size, # of layers, etc. When you get a new board to profile you'll have an idea what settings will get you clo
Electronics Forum | Mon Apr 24 14:08:19 EDT 2000 | Finepitch Services
My agreement with all this started by Arturo's message... Just as a reminder, I guess he suggested to have still "one profile per board" which I completely agree... So, Board #(1,600) could be using a Recipe #(1,10) but it should still be saved as
Electronics Forum | Tue Apr 25 22:59:59 EDT 2000 | armin
If I were you, I would divide my boards into categories...and I'll categorize them by their components e.g. Bds with BGA, with QFP, Bds. with plain chip components...and so on...this is to create a recipe for each components with QFP's, BGA's etc...t
Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler
We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build
Electronics Forum | Wed Apr 19 14:07:20 EDT 2000 | Russ Cutler
Let me see if I've got this straight...rather than hook up a MOLE or a KIC profiler to each and every board (600 P/N's in my case), most people are making judgement calls based solely on how similar a board looks to another board, for which they have
Electronics Forum | Tue Oct 19 14:51:27 EDT 1999 | Kiet Dang
I'm trying to set up a SPC for a thermo compression beam lead attach process. We're using a west bonder thermo compression machine. I'd appreciate any input on temperature, pressure,tool, and critical process considerations. thanks, -kiet.
Electronics Forum | Fri Mar 18 10:05:54 EST 2005 | cyber_wolf
Does anyone know of any studies that have been done on different types of thermo couple attachment? In particular I am interested in the temperature differences that are seen with the different methods of attachment.
