Technical Library | 2020-06-02 15:16:51.0
A commercial systems manufacturer working on a major defense program contacted the Helpline for urgent assistance with an issue of failed parts during reliability testing. They were attempting to incorporate commercial off-the-shelf (COTS) computer-related hardware into a battlefield system and were experiencing reliability issues. It was noted that the parts were labeled by the vendor as "compliant to military (or MIL) standards" but not clearly identified as tin-lead or lead-free. ACI Technologies has supported a number of customers with lead-free issues and we assisted the customer in developing a short term and long-term solution to their problem.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Technical Library | 2024-02-26 09:08:23.0
Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
Technical Library | 2012-06-21 23:06:06.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion
Technical Library | 2018-03-05 11:17:31.0
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year. There are no drop-in replacement alloys for tin-lead solder, which is driving a fundamental technology change. This change is forcing manufacturers to take a closer look at everything associated with the assembly process: board and component materials, logistics and materials management, solder alloys and processing chemistries, and even soldering methods. Do not expect a dramatic change in soldering behavior when moving to lead-free solders. The melting points of the alloys are higher, but at molten temperatures the different alloys show similar behaviors in a number of respects. Expect subtler changes, especially near the edges of a process window that is assumed based on tin-lead experience rather than defined through lead-free experimentation. These small changes, many of them yet to be identified and understood, will manifest themselves with lower assembly yields. The key to keeping yields up during the transition to lead-free is quickly learning what and where the subtle distinctions are, and tuning the process to accommodate them.
