Technical Library: tombstone and parts (Page 1 of 3)

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

00345186 27856240 0020 5283 pick and place parts L&A Ea Mch Fuehrungswagen Kwve

Technical Library | 2022-10-31 09:05:54.0

Warranty: 3 Months Precision: High Precision Certification: CE,ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

Technical Library | 2012-01-26 20:28:34.0

In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num

UCLA - Networked & Embedded Systems Laboratory

Facedown Low-Inductance Solder Pad and Via Schemes

Technical Library | 2008-09-04 17:57:24.0

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.

KEMET Electronics Corporation

PCB Assembly With Obsolete Parts and Hard-To-Find Components

Technical Library | 2018-03-13 14:12:34.0

Many companies take their supply chain for granted until they need an obsolete part or a hard-to-find component. Then the importance of having resourceful contract manufacturing partners becomes an incredibly valuable asset.

Power Design Services

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

Printed Electronics: Manufacturing Technologies and Applications

Technical Library | 2023-03-13 19:35:47.0

Translational Research in Additive Manufacturing at GTMI * Additive manufacturing/3D printing process and equipment development (e.g., metal, polymer and composites part manufacturing) * Computational modeling and simulation of additive manufacturing/printed electronics processes * Advanced materials development for additive manufacturing/printed electronics * Application development and demonstration of additive manufacturing/printed electronics

Georgia Institute of Technology

Facility Fluids Metrics and Test Methods

Technical Library | 1999-08-05 10:52:56.0

This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report.

SEMATECH

Focus on temperature and customized sensors

Technical Library | 2016-10-24 14:59:03.0

Temperature measurement is one of the most important physical parameters when determining quality, accuracy and reliability of processes not only in industrial use, but also in almost all human activities. Temperature sensors are produced with different technologies to fit specific application requirements. IST AG has concentrated one part of the development and manufacturing on high-end thin-film temperature sensors. This know-how is partially derived from the semiconductor industry and allows us to manufacture sensors with high accuracy, excellent long-term stability, high reliability and repeatability within a wide temperature range from -200 °C up to 1000 °C. Because of very small dimensions and low thermal mass, the thin-film temperature sensors exhibit a very short response time.

Innovative Sensor Technology, USA Division

Closed‑Loop Recycling of Copper from Waste Printed Circuit Boards Using Bioleaching and Electrowinning Processes

Technical Library | 2021-02-04 01:56:56.0

In the present study, a model of closed-loop recycling of copper from PCBs is demonstrated, which involves the sequential application of bioleaching and electrowinning to selectively extract copper. This approach is proposed as part of the solution to resolve the challenging ... doi.org/10.1007/s12649-020-01128-9

Waste and Biomass Valorization


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