Electronics Forum | Tue Mar 06 03:29:05 EST 2001 | daled
Hello I am looking for any data that confirms the long term reliabilty of no clean paste as opposed to water soluable. Does anyone have any past experiences of problems when changing over from water soluable to no clean in the SMT prcocess?? Thanks i
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup
| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect
Electronics Forum | Fri Jun 25 11:05:19 EDT 1999 | Christopher Cross
| hello, | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | thanks for the input | | wayne | | | We have tried this mainly on thru hole connectors (.035 pins, .1 s
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
