Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Among its many causes, excess solder is the most common culprit. Other causes are high temperatures, moistures, cold slumps, or a problem during the solder paste printing process where the stencil arrangement of the PCB pad configuration is off its mark
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/
. Among its many causes, excess solder is the most common culprit. Other causes are high temperatures, moistures, cold slumps, or a problem during the solder paste printing process where the stencil arrangement of the PCB pad configuration is off its mark
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-pth-components-in-line-with-stranded-wire
. Specifically Section 4, Paragraph 4.18. The intent is to get good wetting between the wire and the component. The problem you may face is overheating the component when connecting the wire to the component itself and from your description you are soldering 2 wires to each component, one wire at each end
| https://www.eptac.com/ask/soldering-pth-components-in-line-with-stranded-wire/
. Specifically Section 4, Paragraph 4.18. The intent is to get good wetting between the wire and the component. The problem you may face is overheating the component when connecting the wire to the component itself and from your description you are soldering 2 wires to each component, one wire at each end
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. Yeah, so what? Is it a problem? Can you prove that it is a problem? Do you have data backing up your claim? Or is it just that they are there and we don’t want them? Man, am I glad
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
? They are finding some! Wow. Isn’t that something? That’s like looking at Swiss cheese and saying there are voids in the cheese. Yeah, so what? Is it a problem? Can you prove that it is a problem
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many of us would agree that we are still facing challenges on one of the common defects – poor barrel fill. The problem is confounded with currently High density/Multilayer thick PCB and applying Lead-free soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
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