Electronics Forum: calling (Page 302 of 335)

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Fri Jun 05 19:33:55 EDT 1998 | Steve Gregory

Hidee Ho Brian! Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. We're a contract assembler as well, just starting up.

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 12:05:43 EDT 1998 | Anthony

Dear Dave, I have a "possible" solution to your problem, though I have never tried it myself. If you're trying to come up with a non-abrasive technique for removing solder-keep reading. If it's a faster method you desire, do yourself a favor and hi

Re: Selective Soldering wih Drag Machine

Electronics Forum | Mon May 25 23:26:19 EDT 1998 | Jon Gruett

I agree with Mike. They are a dead issue. As a manufacutrer's rep for many types of equipment and 11 years in the engineering field I have seen several attempts to revive the technology (if you can call that technology). Most if not all attemptds

Re: Ok Earl I give already!

Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon

| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to

Re: Hewlett Packard 5DX X-ray system

Electronics Forum | Thu May 21 11:39:21 EDT 1998 | Brian L. Pollitt

| We are looking to bring in a HP 5DX System. This is | the laminography equipment formerly known as Four Pi. | I have our sales rep getting us a few references, but I | wanted to get some opinions from the tech net. | I am looking for input from

Sorry for offending a few of you

Electronics Forum | Mon Apr 20 21:53:53 EDT 1998 | Martin Plourde

About 1 1/2 month ago, I discovered this SMT forum and I am quite pleased about it since I've learned quite a bit through it all. Unfortunately, there are a few people who seem to have everything they need "equipmentwise". Well, I am glad for you. I

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech

| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: SM Headers & Connectors

Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr

Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a


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