Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Thu Feb 12 16:42:33 EST 2015 | hegemon
I can only speak for Mirtec and Yestech AOI for SMT Solder Inspection. We do use Koh-Young AOI for Solder Paste Inspection. As usual ,you need to identify exactly what it is you are trying to achieve with your AOI, if you are just trying to fill a
Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Wed Jan 03 21:14:04 EST 2001 | Greenman
This is news to me that I seriously doubt. Couldn't be someone from the competition that told you this, could it? Tim Skidmore just got made Chair of the IPC Solder Paste Task Group, so if they're pulling out of solder altogether (to do what instead
Electronics Forum | Wed Oct 20 06:23:54 EDT 2004 | C Lampron
Hi Matt, Sounds like the HASL may be to thin on some pads and you're getting copper migration. If this is the case, and the solder paste is printing, I would asume you would see some solder balls under the BGA at X-Ray or incosistancies in ball size
Electronics Forum | Mon Nov 29 13:09:12 EST 1999 | Mike Konrad
There are three primary methods of stencil cleaning. � Hand Cleaning � Spray-In-Air Cleaning � Ultrasonic Cleaning Hand Cleaning: Hand cleaning involves the removal of solder paste or adhesives from stencils using a chemically saturated wipe and /
Electronics Forum | Tue Nov 07 12:07:10 EST 2023 | tommy_magyar
We are mounting an microphone device (SMT package) onto a PCB - how? Surface mount line or hand soldering? Contamination can only come from the solder paste, solder wire, flux, or burning the component/PCB assembly during hand soldering. Unless the
