Electronics Forum | Wed Jul 14 13:22:51 EDT 1999 | kt
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Mon Jul 30 16:34:45 EDT 2007 | John S.
We're seeing shorting from the lead of an electrolytic cap to the can. It appears to be solder wicking up the lead, through the boot, and then shorting to the can. Has anyone else experienced this? It is a very cheap cap from China of course, but
Electronics Forum | Tue Jun 13 09:14:37 EDT 2006 | samir
As I mentioned in another thread, I've always been one to flux the living crap out of a board until the ICT guys start yelling at me, which actually did happen last week. I had a little oriental guy (an immigrant to Riyadh from Vietnam), clicking an
Electronics Forum | Sun May 02 07:36:47 EDT 2004 | mk
Use solid solder deposit for GGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Sun May 02 07:37:28 EDT 2004 | mk
Use solid solder deposit for BGA's and you will not have shorts, opens, voids or need cleaning. Simple as that. mkehoe@sipad.net www.sipad.net
Electronics Forum | Tue Dec 21 13:18:18 EST 1999 | John Sims
My company is just beginning in SMT. We are using a glue and wave solder process to build mixed technology boards. Our components are mostly 1206 and 0805 chips. The designers are wanting to use 0603's on an upcoming board. I'm concerned that the
Electronics Forum | Mon Sep 20 19:52:18 EDT 2004 | pabloquintana
We use axial components together with some SMDs on the same board. Because the components have leads greater than .180 we have to Roto trim them after wave soldering. We are looking into avoiding the roto trimming of the boards, but we need to find
Electronics Forum | Wed Nov 23 07:39:14 EST 2005 | chunks
Shorted to the sheild or the BGA balls are shorted? Sheilds move a lot during reflow. If this is the case, place some adhesive or peelable solder mask on either side of the shield and baords to stop it from moving.
Electronics Forum | Mon May 30 06:36:16 EDT 2011 | mbnetto
This is a requested point from some customers. It's part of the audit check points. But I agree it´s important for the process. You can garantee the stencil is in a good condition after many time using it. If your stencil looses the tension, you can
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
