Electronics Forum | Thu Aug 27 12:28:02 EDT 1998 | Ryan Jennens
| | What approach do you you use to reducing wave solder dross? What is your experience with Klennox? | | Dave F | Klennox should be spelled Kleenox. Dave F Kleenox works well for removing accumulated dross as it separates the dross from the solde
Electronics Forum | Tue Jul 14 16:53:43 EDT 1998 | B. Decker
| | | Dear Colleagues: | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | I need data not opinions. | | Thanks in advance for your help. | | Sincerely
Electronics Forum | Thu Apr 16 14:09:04 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Thu Apr 16 14:07:49 EDT 1998 | Lou Madge
Dear Collegue, A seminar tittled "Things that you should know before selecting an alternative surface finish" will be offered on Friday, April 24 (during the week of the Nepcon East show) in Philadelphia. Topic that will be discussed include: Evalua
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Wed Sep 05 08:22:48 EDT 2001 | davef
Jack Crawford, IPC Director of Assembly Standards and Technology says "IPC-7912 is used for end-item DPMO calculation; one gathering of DPMO data at the end of the entire assembly process. IPC-9261 will be used throughout the manufacturing process so
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Fri Jan 11 04:20:52 EST 2002 | wbu
It�s up to you what and how you perform. I was only wondering how your figures match with todays performance efforts and predictions made by the industry. The stress today is obviously on change over times and concepts to minimize this time especiall
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