Electronics Forum | Wed Mar 28 19:40:14 EST 2001 | Rob Fischer
Try a search engine and look up "+solder+pallet". Any of the major pallet manufacturers can supply this or any other composite materials that you may be looking for. Of course (as I am employed by EMC) I would prefer you choose my site. Try to kee
Electronics Forum | Wed Apr 04 12:02:33 EDT 2001 | Adam
Guys Is it possible to completely eliminate random solder/microsolderballs from No-Clean products that go over the wave. The Assembly is a mixed technology product which is HASL finished. All profile types have been exhausted, 3 flux vendors have be
Electronics Forum | Wed Apr 04 12:35:15 EDT 2001 | davef
These solder balls are where [top / bottom]? Describe the breadth and degree of this problem across all assemblies. Finally, describe your wave solder machine, a common profile for this board, and the board [beyond that it's mixed tech, like are
Electronics Forum | Tue Nov 28 15:06:59 EST 2000 | rabell
We have recently moved our "ESD: See it! Believe It! Control It!" product to a network version. This particular course is aimed at engineers and technicians, and these people typically already have a computer on their desktop, so providing the train
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Wed Jun 06 20:25:06 EDT 2001 | davef
Good machine, good people; yer just about there. Look here for help: http://www.mot.com/SPS/PowerPC/teksupport/teklibrary/papers/BGA_AssemblyRework.pdf http://channel.intel.com/design/quality/component/rework_socketprofiles.htm Earl Moon, a depart
Electronics Forum | Wed Jun 13 17:50:06 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Wed Jun 13 17:50:28 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Fri Jun 22 10:54:40 EDT 2001 | davep
The part is a high pin count PBGA with an integrated ceramic heatsink. What I am trying to understand is how to handle this part in production. It seems as though you would have to have an oven very near your SMT line, pulling a few trays of parts
Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu
Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as
