Electronics Forum | Wed Apr 28 04:26:24 EDT 1999 | Nigel Burtt
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
Electronics Forum | Thu Apr 15 00:26:38 EDT 1999 | Owen
| I need help in finding solder paste measuring equipment. | No matter what measuremnt system you purchase, make sure that you perform a Gage R&R study to determine whcih system can meet your standards. Most manual measuremnt systems cannot adequa
Electronics Forum | Thu Apr 15 00:32:16 EDT 1999 | Owen
| | I need help in finding solder paste measuring equipment. | | | No matter what measuremnt system you purchase, make sure that you perform a Gage R&R study to determine whcih system can meet your standards. Most manual measurement systems cannot
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Fri Mar 18 19:17:37 EST 2005 | valuems
Hello PMD Don't feel like that, we live with these MPM's. And we have over 10 years experience. Also never mess with the down stop on any MPM and you will be better off. Most of mpm's machines have a down stop of .0750 and it should never be cha
Electronics Forum | Fri Feb 15 08:44:42 EST 2008 | mmjm_1099
FYI, Here are the steps in which we take to get approval. The stencil gerber layer needs final approval through our Engineering dept. What they do is send in a gerber layer from the stencil house and lays it over the current solder paste layer and ve
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Fri Oct 22 11:37:38 EDT 1999 | Brett Gordon
Working DFM SMT issues with respect to a client's artwork together with a heavily modified solder stencil, I was able to reduce 0402 tombstoning from 80% across the board to 3%. I winged the aperture reductions, but are there any "rules" or guidelin
Electronics Forum | Mon Jan 12 02:45:53 EST 2009 | sachu_70
Hi Stefano, Although your concept of Wave soldering such devices is possible, I would look at an alternate solution. An easier way would be to Reflow solder all Bottom side SMD components with solder paste, followed by wave soldering for only through
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
