Electronics Forum | Fri Jul 09 17:50:20 EDT 1999 | Jim Blankenhorn
Hi Carol- What you are asking for can be done. Variables you must account for include the paste viscosity, dispensing head speed, dispenser height relative to board surface, and needle size. You can use most any semi-automated system such as Camalo
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 07 08:06:03 EDT 1999 | Hon Choi
| | Hi all, | | | | We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty
Electronics Forum | Tue Feb 23 09:21:15 EST 1999 | Steve Schrader
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Tue Dec 29 08:11:18 EST 1998 | Kelvin Chow
As CSP and BGA packages become more and more popular, I want to know if anyone get problem to assembly CSP packages. Currently, most CSP use 20mil solder ball diameter and it is a trend to go down to 16mil or even 12mil. I wonder if there is a probl
Electronics Forum | Thu Nov 05 17:39:21 EST 1998 | Dave F
| Is there anyone who can help me with the average profile to start and speed of the above-mentionned oven ? Have you used the blower at any other setting than 100% use? | Barbe: The first pass at setting your profile should be based on: 1 Sol
Electronics Forum | Wed Oct 07 06:22:23 EDT 1998 | Charles Stringer
| I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remainin
Electronics Forum | Fri Oct 02 11:59:37 EDT 1998 | jon Medernach
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Just a sugge
Electronics Forum | Thu Feb 06 13:18:43 EST 2003 | Vince Cook
Mr. Fuller, I came across your inquiry while doing some light lunchtime reading. I work for Universal in the group that creates nozzles/grippers. We evaluate applications involving a wide vareity of components, connectors, etc. I'm not a salesman
