Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Mon Nov 12 16:11:59 EST 2001 | davef
Listen. Reworking 0201 is too expensive. Here�s watt yado � * Cut the lil� suka between the pads on the board using side cutters. * Flick each piece from its pad, after melting the solder with a standard soldering iron. * Solder the terminations
Electronics Forum | Mon Nov 12 17:12:40 EST 2001 | slthomas
Thanks, Dave. Three courtesy cheers for specifications written to reflect the capabilities of the part suppliers, even if they fail to meet the purchaser's (not unreasonable) process req'ts. In the meantime, I'm sure my stencil guy would be more
Electronics Forum | Wed Nov 28 07:44:33 EST 2001 | stefwitt
Justin, you will find measuring equipment at http://www.omega.com All sensor signals are in uV or mV and require a signal amplifier. If you get an amplifier with display, you can program a conversion factor for mV to board stretch and it will show a
Electronics Forum | Tue Dec 04 09:35:58 EST 2001 | jdill
I have successfully reflowed 208,100 pin QFP'S and SOJ 28's on the bottom side of the board. The only thing i am "SCARED" to reflow on the bottom side are BGA'S. We used to turn off the bottom heaters but we did a trial run with them off and the boa
Electronics Forum | Mon Dec 17 17:30:40 EST 2001 | davef
One of our board fabricators says that carbon inks should be selected based on the process to be used by the assembler. So, their take on this question has some inks that work fine with nc fluxes, others that do not. They suggest: * Determining t
Electronics Forum | Thu Jan 03 06:45:42 EST 2002 | Scott Davies
Hany, Tg is "Glass Transition Temperature". For an informative explanation of what this is, take a look at; http://www.psrc.usm.edu/macrog/tg.htm MLB = Multi Layered Board Does the board which you have the problem with only pass through the wave
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Thu Feb 07 16:12:17 EST 2002 | Phil the Quality Guy
Recent discussions have risen lately regarding the in-house transferring and handling of populated printed circuit boards using unpainted wooden slats with notches cut in them. Wood may be at the high end of the neutral triboelectric scale but does
Electronics Forum | Tue Feb 26 07:55:23 EST 2002 | cyber_wolf
I know that there is an IPC spec. for board pad size design for BGA components. After a little research we have found that recommendations vary from component manufacturers to board houses. (These recommendations are different than what IPC says....
