Electronics Forum | Tue Dec 22 12:08:06 EST 2015 | aqueous
The overwhelming technology used in post-reflow cleaning of electronic assemblies is aqueous. Prior to the 1990's, solvents and vapor degreasers dominated the cleaning industry. After the popular solvents were banned via a United Nations treaty, alte
Electronics Forum | Sun Aug 28 23:53:58 EDT 2016 | aemery
I don't think there is a camera off message in the software, but I might be wrong. So I am making a bit of an assumption here that you didn't have a displayed image and your error was a fiducial not found error. I am also wondering if you decided to
Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob
Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s
Electronics Forum | Tue May 16 02:12:58 EDT 2017 | robl
Hi Anthony, Hopefully some of the following may help: 1) Electrics - do you know the rating of each machine and the total load, and can your distribution box take it? Do you have the correct cabling and connectors in place to just plug the machines
Electronics Forum | Wed Feb 14 16:58:12 EST 2018 | cbart
you would be best to get this from your paste/solder manufacture. but here are some rules of thumb: -Solder paste out of fridge before use - get out the night before needed.. don't let your op's warm on the oven!! you will regret that! if not over ni
Electronics Forum | Fri Mar 09 01:48:26 EST 2018 | aemery
Unfortunately Gerber EZ is probably the one thing I know very little about. As an FSE with Speedline I only had one client at that time that was using it and an application engineer came in and helped them with it. Sorry I can't give a direct answer
Electronics Forum | Thu Mar 15 13:39:06 EDT 2018 | gregp
Impact is the instantaneous force at the time the component first reaches the PCB. F=M*a....so the acceleration is the key factor. If charted on a graph it would look like a spike...higher force for a short duration. The placement force is typical
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Sun Oct 11 16:20:49 EDT 2020 | kumarb
Hi. My 2 bits...from your list, we have had communication with Seamark and our experience so far has been very positive. We are reviewing to purchase one of their BGA rework systems, primarily from the video on youtube showing Louis Rossman running o
Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
