Electronics Forum: designation (Page 32 of 537)

Solder Robbing Pads

Electronics Forum | Tue Jun 25 13:30:42 EDT 2002 | Jeff Park

Folks, I am interested in learning more about solder robbing pads to help and avoid bridging for wave solder applications. I have heard of a few companys that use this process in their design but have not seen any documents for design rules etc.

solder crack

Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc

Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 09 09:31:35 EST 2002 | MA/NY DDave

Hi Just one idea, many exist. If your electrical designers can tolerate it, sometimes a cross hatched design is used under areas where electrical performance is important. It reduces coupling and impedance effects compared to a full layer. Elimina

PCB Surface finish

Electronics Forum | Tue Jun 22 11:14:03 EDT 2004 | Steve Thomas

A very quick survey regarding PCB finishes for a lead-free process. What is the most popular PCB finish for lead-free soldering ? Who drives the selection of the finish, assembler or designer ? Are tin whiskers an issue for anyone ? I'm coming at th

Deciding On pad size using just the component footprint

Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd

I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4

Deciding On pad size using just the component footprint

Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef

We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to

SMT Stencil Aperatures

Electronics Forum | Sat Jun 04 08:51:26 EDT 2005 | pjc

IPC-7525 is a document that provides guidlines for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus documen

Double sided design

Electronics Forum | Wed Aug 24 11:48:37 EDT 2005 | Anthony

Hello, we are currently designing our first PCB with surface mount components on both sides of the board. I understand about solder thieves in order to help short circuits. Are there any good white papers or books which identify the best practices w

BGA ball Separation

Electronics Forum | Tue Jul 25 12:14:39 EDT 2006 | russ

All my studies led me to believe that it was CTE mismatch of this package. Altera was of less than 0 help in this matter. The other possibility was an ICT test fixture. Unfortunately (?) the design life of this product was at end and the new design

Coating under Mil connector....

Electronics Forum | Thu Dec 22 16:12:51 EST 2005 | chunks

Off the Cuff Answer: Wow, nice big ugly connector! Thought we were the only ones using these things designed during the Korean war. Actually it really depends on the customers print. If they want conformal coating, they should know exactly where


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