Electronics Forum | Tue Apr 15 15:10:28 EDT 2008 | markhoch
We currently are using an older Electrovert Convection 7-Zone reflow oven for our Lead-Free assemblies. It has a maximum per zone Temperature setting of 280 Degrees C. This is causing an issue with one particular customer who has a fairly dense produ
Electronics Forum | Tue Mar 08 15:35:43 EST 2016 | fuji_user_2014
I am having problems with LGA solder balls under the devices. Here are some of the details: 1. There are only 2 affected parts @4 locations. 2. The parts are LTM4616EV#PBF and LTM4608AEV#PBF. 3. We are using a ramp soak spike profile. 0-100secs=r
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk
We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Tue Jun 26 12:24:24 EDT 2001 | nifhail
Thanx for the reply Dave. We actually had a few thermocouples attached from underneath to see if there is any delta in temperature within the same BGA's ball. They looks OK, with the slope of 1 -2 Deg C,soak at 120 Deg C - 150 Deg C at about 90 sec,
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Mon Jun 25 09:08:22 EDT 2001 | Dave G
What type of board finish ? I've seen this same defect with QFP's on some of our HASL boards. Best I can tell either the PCB's have poor solderability or uneven pad heights due to poor solder leveling at the PCB fab. Newer PCB's seem to yield bette
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