Electronics Forum | Mon Aug 10 10:25:54 EDT 1998 | MikeC
| Hello all, welcome to the NEW home of SMTnet. We have been spending a good amount of time preparing for this switch, and we are curious about what you think. | What do you like/dislike? | Anything you'd like to see different? | Any other comments a
Electronics Forum | Thu Aug 06 12:58:35 EDT 1998 | Paul J. Lingane
Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not elect
Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis
Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If
Electronics Forum | Tue Aug 11 12:15:34 EDT 1998 | X-man
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai Stoney, Probably the best rewor
Electronics Forum | Fri Jul 17 12:49:33 EDT 1998 | Aaron Delfausse
We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are ou
Electronics Forum | Wed Jul 15 13:33:56 EDT 1998 | Don Welling
I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress diff
Electronics Forum | Mon Jul 20 22:08:58 EDT 1998 | Dave F
| | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you
Electronics Forum | Wed Jul 08 20:57:11 EDT 1998 | hyeon-jin Kim
I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. After reflow soldering, we have often "blister phenomenon". Our reflow profile is normal. Factory conditio
Electronics Forum | Tue Jul 07 03:34:06 EDT 1998 | Martin Kelly
Hi just to let you know, in case you don't, but an x-ray machine is needed too check the solder balls, once they've been placed. See you later, | | I am very interesting of getting information about the criteria inspection of BGA. Example, what are
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
