Electronics Forum: controllers (Page 313 of 369)

Fuji Pick and Place Machines

Electronics Forum | Sat Jun 05 08:18:03 EDT 2004 | vinitverma

Hi Grant, If you're really looking for speed, I'm sure you're looking for another machine for doing the QFPs, BGAs stuff etc. In that even, why not have a look at the long proven Assembleon FCM machine!! It is a totally different concept with UNMATC

Reflow profile basics

Electronics Forum | Mon May 10 09:30:35 EDT 2004 | davef

Q1: What are the basic requirements of thermal profiling? A1: Not sure what you�re looking for here, but when doing a profile, you�re trying to measure the temperature at specific points of the board, as the board moves through the oven. Q2: How we

Pb-Free wave Soldering - With or Without N2 ?

Electronics Forum | Mon May 17 20:39:49 EDT 2004 | Ken

I disagree about the maintenance issues with tin/copper solder. All high tin content solders are hard on machines (silver or not). More dross? Controlling the back flow, front flow velocity and AVOID constant surface cleaning will reduce your dros

Hand tools @ work station ?

Electronics Forum | Tue May 18 14:23:07 EDT 2004 | tigerlordgm

If your main concern is keeping small hand tools at specific work areas, such as placement machines and screen printers, then you can try a few different things. First, many machines have an access panel that is key controlled. If you place the tool

Replacement for nitrogen in the reflow oven

Electronics Forum | Mon May 24 06:00:23 EDT 2004 | johnwnz

call me picky but doesn't hydrogen combust? maybe soemthing you could do is look at your process and your products and decide if you actually need to run in N2. Yes ok I can hear the crys now but seriously, for the vast majority of things if you have

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz

Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu

BGA rework station

Electronics Forum | Tue Jun 15 15:57:00 EDT 2004 | russ

I have used one in the past and wish I had one now. Is that enough input? We had great success with this machine. The large lower preheat and board supports worked very well for large thin boards. We never experienced any problems with this machi

AOI System

Electronics Forum | Thu Jul 01 13:47:25 EDT 2004 | Tom B

Good Day! I am looking to purchase a Cyberoptics KS-Flex 18 AOI system, I have a couple of question that if you could answer, I would most appreciative. 1) Model and length of time used. Do they use AOI for all pwbs or just the more complex a

BGA open joint

Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.

You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test

Lead Free ...

Electronics Forum | Tue Aug 31 22:03:30 EDT 2004 | KEN

If you have control over your design (as in an OEM) ENTEK can be a managable alternative. IF your like me (a CM), you get one of everything ever imagined. There has been much ado with ENTEK. Not every product is apropriate. For instance I have cu


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