Electronics Forum | Tue May 02 01:55:13 EDT 2000 | Erhard Hofmann
You are right, I am looking for a solution to place small components, 0603, 0805, 0402, and similar. The components will be fed by a vibratory feeder and placed onto trays. This is happening in the comp manufacturing stage and the trays are used as a
Electronics Forum | Wed Apr 26 17:33:24 EDT 2000 | John
I agree with what has been said, P pattern takes some playing with, but length and width need to be what the machine is seeing not actual (use trace). The biggest improvement I got was slowing the frontlight scan speed to 50% of backlight setting in
Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F
Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles
Electronics Forum | Mon Apr 24 14:08:19 EDT 2000 | Finepitch Services
My agreement with all this started by Arturo's message... Just as a reminder, I guess he suggested to have still "one profile per board" which I completely agree... So, Board #(1,600) could be using a Recipe #(1,10) but it should still be saved as
Electronics Forum | Tue Apr 25 22:59:59 EDT 2000 | armin
If I were you, I would divide my boards into categories...and I'll categorize them by their components e.g. Bds with BGA, with QFP, Bds. with plain chip components...and so on...this is to create a recipe for each components with QFP's, BGA's etc...t
Electronics Forum | Mon Apr 17 16:17:47 EDT 2000 | Dennis Fall
Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am intere
Electronics Forum | Mon Jun 19 16:59:07 EDT 2000 | D.A.Munro
We use both Nc and Ws at wave and reflow, Nc is less forgiving and the board topside must reach aprox.110c prior to wave to be fully activated. Your application of the flux is even more criticale,it's not very agresive for one thing and apply to much
Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Tue Apr 11 16:11:06 EDT 2000 | John Thorup
Hello Ashok I can't recall mask damage through normal handling that did not have an adhesion or cure problem as its root cause. Most of our boards arrive shrink packed in groups of 10. We simply pop off the wrap one pack at a time and leave them in
Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel
Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,
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